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CYStech Electronics Corp.
2.0Amp. Surface Mount Schottky Barrier Diodes
Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date : Page No. : 1/3
SK2XSA Series
Features
* For surface mounted applications. * For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications * Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 * Low leakage current * High surge capability * High temperature soldering: 250C/10 seconds at terminals * Exceeds environmental standards of MIL-S-19500/228 * Pb-free package
Mechanical Data
* Case: SMA/DO-214AC molded plastic. * Terminals: Solder plated, solderable per MIL-STD-750 method 2026 * Polarity: Indicated by cathode band. * Packaging: 12mm tape per EIA STD RS-481. * Weight: 0.064 gram, 0.002 ounce
Maximum Ratings and Electrical Characteristics
(Rating at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz,
resistive or inductive load. For capacitive load, derate current by 20%. )
Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=2A Maximum average forward rectified current @ TL = 100 Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current @ TJ = 25 At Rated DC Blocking Voltage @ TJ = 100 Maximum thermal resistance, Junction to ambient(Note 1) Diode junction capacitance @ f = 1MHz and applied 4V reverse voltage Operating Junction and Storage temperature Rang
SK3XSA
Symbol VRRM VRMS VR VF IO IFSM
SK22 20 14 20 0.5
SK24 40 28 40
Type SK26 60 42 60 0.7 2.0 50
SK28 80 56 80
SK2B 100 70 100
Units V V V V A A mA mA /W pF
0.85
IR Rth,JA CJ TJ, Tstg
0.5 10 88 (typ) 110 (typ) -55 ~ +125 / -55 ~ +150
Notes : .Mounted on PCB with 14mm (0.013mm thickness) copper pad area.
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date : Page No. : 2/3
SK22-SK24 SK26 SK28-SK2B
SK3XSA
CYStek Product Specification
CYStech Electronics Corp.
SMA Dimension
Spec. No. : C753SA Issued Date : 2006.07.13 Revised Date : Page No. : 3/3
Marking : Device SK22 Code SK22 Device SK2B Code SK2B SK24 SK24 SK26 SK26 SK28 SK28
A
B
C
D
H E F G
SMA/DO-214AC Plastic Surface Mounted Package CYStek Package Code : SA
*:Typical
DIM A B C D
Inches Min. Max. 0.055 0.062 0.098 0.114 0.157 0.181 0.078 0.096
Millimeters Min. Max. 1.40 1.60 2.50 2.90 4.00 4.60 2.00 2.44
DIM E F G H
Inches Min. Max. 0.030 0.060 0.002 0.008 0.188 0.208 0.006 0.012
Millimeters Min. Max. 0.76 1.52 0.051 0.203 4.80 5.28 0.152 0.305
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK3XSA
CYStek Product Specification

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